Multi-Layer Chip Baluns For WiMAX Break Size Barrier

April 9, 2007
Introduced as the industry's smallest, the AMB1608C series multi-layer chip baluns for WiMAX and Mobile WiMAX designs measure 1.6 mm x 0.8 mm x 0.6 mm. The components specify a low insertion loss of 0.6 dB and operating frequencies of 2.5 GHz and 3.6

Introduced as the industry's smallest, the AMB1608C series multi-layer chip baluns for WiMAX and Mobile WiMAX designs measure 1.6 mm x 0.8 mm x 0.6 mm. The components specify a low insertion loss of 0.6 dB and operating frequencies of 2.5 GHz and 3.6 GHz. The four baluns in the series exhibit a typical return loss of 15 dB and an unbalanced impedance of 50Ω. Balanced impedance, depending on the model, is either 50Ω or 100Ω. Samples will ship in April. FDK AMERICA INC., San Jose, CA. (408) 432-8331.

Company: FDK AMERICA INC.

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