Thermal Software Models IC Packages

Flomerics’ Flopack V6.2 is the latest version of its web-based SmartPart library that generates fast, accurate thermal models for IC packages and associated parts. Thermal models created within Flopack can be instantly imported into Flomerics’ Flotherm or FloPCB software to analyze the cooling requirements of electronic components, boards and systems. Key features contained within Flopack V6.2 include: a major expansion of the power/discrete semiconductor package library; a parametric rules engine that checks for errors in design data inputs; an enhanced, more accurate model for bond-wires; and overall improved usability.