Powerelectronics 1830 0909ohmmite

Modular Heatsink Expands Cooling Options

Sept. 10, 2013
Ohmite Manufacturing announces their high performance C40 with modular cooling benefits.

Designed to provide engineers with a variety of cooling options, the C40 heatsinks from Ohmite Manufacturing feature flexible board mounted modular assembly that can be used in conjunction with up to four TO-247 and TO-264 power resistors, or similarly packaged passive and active components.

Ideal for a wide variety of industries, these 58mm heatsinks can be used individually or in compact paired configurations. Patented camming clips (sold separately) easily secure the devices in place without the need for holes or screws. In order to create active cooling and enhance their thermal capacity in back-to-back paired operations, the C40 heatsinks include pre-configured mounting holes to accommodate a standard 40mm x 40mm fan.

Customers have the option of a single extrusion with one or more clips, or two extrusion halves back-to-back with any clip configuration needed to mount the TO package devices. For unique solutions requiring more devices, Ohmite can provide custom lengths for additional mounting space. Heatsinks and clips can be purchased individually, or designers can opt for Ohmite to assemble a fully customized system with customer specified components. Ohmite offers complete assembly and the delivery of a thermal solution directly to the user.

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