Powerelectronics 3479 045083 Indium Corporation Promo
Powerelectronics 3479 045083 Indium Corporation Promo
Powerelectronics 3479 045083 Indium Corporation Promo
Powerelectronics 3479 045083 Indium Corporation Promo
Powerelectronics 3479 045083 Indium Corporation Promo

Heat-Spring Thermal Interface for IGBT Assembly

June 18, 2015
Indium Corp.’s Heat-Spring is a compressible soft metal shim that serves as a thermal interface between the baseplate and heat-sink to ensure maximum heat transfer in IGBT and high power module mounting applications.

Indium Corp.’s Heat-Spring is a compressible soft metal shim that serves as a thermal interface between the baseplate and heat-sink to ensure maximum heat transfer in IGBT and high power module mounting applications.

Heat-Spring is designed to fulfill large-area thermal transfer requirements with metallic transfer properties of up to 86 W/mK. Heat-Spring is easy to use and offers superior conductivity as compared to thermal grease alternatives. In addition, Heat-Spring will not bake out or pump out, optimizing long-term performance consistency and eliminating the rework process.

Heat-Spring is reclaimable and recyclable, and can be packaged in custom trays or tape & reel. Indium Corp. also offers custom packaging options as needed. Heat-Spring is just one of a wide range of Indium Corp. solders and TIMs for IGBT assembly.

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