Rugged CPU Module Offers IPC Class 3 Assembly

Rugged, highly-integrated COM Express mini form factor board combines Intel Atom E6x0T low power processor with optional TPM security chip and Type 10 COM interface.
April 10, 2013

VersaLogic’s VL-COMm-26 exceptionally rugged COM board, based on the COM Express mini form factor (55 x 84 mm), is a highly-integrated embedded computer combining the Intel Atom E6x0T low power processor with an optional TPM security chip and Type 10 COM interface. Designed and tested for highly reliable -40º to +85ºC operation in demanding environments, including extreme temperature, impact and vibration, the board is available manufactured to IPC-A-610 Class 2 standards, while Class 3 assembly is offered for extreme reliability requirements. An 8 V to 17 V input voltage range simplifies system power supply requirements, and thermal monitoring reduces power consumption to remain within specified operating limits. A Type 10 pin-out provides Gigabit Ethernet, seven USB ports, three x1 PCIe lanes, two serial interfaces, Intel HDA, LPC, and SMBus to the carrier board. An auxiliary board-to-board connector provides two additional serial interfaces and a CAN interface. Dual SATA 3 Gb/s interfaces support high-capacity rotating or solid-state drives. A microSD socket and SDIO interface provide SSD options. The VL-COMm-26 is available from stock with prices starting at $526 for 1 GB RAM models in OEM quantities.

VERSALOGIC CORP.

Sign up for Electronic Design Newsletters
Get the latest news and updates.

Voice Your Opinion!

To join the conversation, and become an exclusive member of Electronic Design, create an account today!