Electronicdesign 21159 Promo Bracket Challenge 1

Engineering University Challenge, Round 2

March 16, 2018
Thirty-two U.S. engineering universities have been pared down to 16. It’s time for round two of the tournament, and once again we need your input.

Our annual Engineering University Bracket Challenge is now into round 2 (see figure). You have pared down the initial 32 U.S. engineering universities to these 16:

  • Virginia Tech
  • Duke
  • Cornell
  • Texas A&M
  • MIT
  • University of Wisconsin
  • Georgia Tech
  • University of Texas
  • Stanford
  • Iowa State
  • Penn State
  • University of Illinois
  • John Hopkins
  • University of Michigan
  • Purdue
  • Northwestern

The selected university that makes it to the end will win an exclusive event on its campus with food, music, and prizes. One lucky university student will win the grand prize: an all-expense-paid, three-day trip to Maker Faire, May 17-20, 2018, in San Mateo, Calif.

We are down to the sweet 16 in our annual single-elimination tournament, and we need your input for round 2.

As you know, I am a Ramblin’ Wreck from Georgia Tech, but my vote doesn’t count. Luckily, a few others did, so it made it to round two. So did Northwestern, along with 14 others. Now it’s time for round two, so don’t forget to add your vote again (and ping your alumni, too).

In addition to bragging rights, one student from the top four universities will have a chance to win a Digi-Key InstaLab. Three random participants who vote and register in a single round will win a $50 Amazon gift card, while five random participants who vote and register for all the rounds will win a $100 Amazon gift card.

The competition is brought to you by Electronic Design and Machine Design, plus our sponsors Digi-Key, Microchip, and Renesas.

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