Electronicdesign 23592 0918 Editorial Promo

Cool Parallel-Processing Tech at Hot Chips Symposium

Sept. 5, 2018
Machine learning and 5G were two topics in particular that turned up the heat at this year’s Hot Chips Symposium.

The Hot Chips Symposium is where the cutting-edge technology appears, and this year is no different.  Parallel processing is the name of the game, especially when it comes to 5G and machine-learning (ML) solutions.

We got a more detailed glimpse at Xilinx’s “Everest” adaptive compute acceleration platform (ACAP) that targets 5G and ML. ACAP is a tile-based architecture that’s commonly found in high-performance computing and network processing (Fig. 1). The non-blocking interconnect delivers over 200 GB/s/tile and adjacent cores can also share results. The instruction set includes integrated synchronization primitives. Like an FPGA, the system is scalable, allowing large arrays to tackle more ambitious projects.

1. Xilinx’s adaptive compute acceleration platform (ACAP) is built around a tile-based network of parallel processors.

Tachyum’s Prodigy chip targets networking applications with a pair of 400-Gb Ethernet links to feed its 64-core chip (Fig. 2). It’s designed to address ML applications that are becoming increasing important in managing and delving into the contents of network traffic. The cores use out-of-order (OOO) execution courtesy of the compiler. It implements instruction parallelism by applying poison bits. All of the I/O is linked via a high-speed ring that also connects to the multicore fabric.

2. Tachyum’s Prodigy chip sports a 64-core array with 400-Gb Ethernet support to handle networking tasks.

On another front, Arm lifted the veil more on its ML processor. It includes features like static scheduling, where convolution operations wait until data is DMA’d into memory, providing relatively predictable performance (Fig. 3). Convolution output feature maps are interleaved across compute engines; weight and feature map compression support reduce data and power requirements.

3. Arm’s machine-learning processor can synchronize convolution operations with DMA transfers.

Mythic explained its matrix multiplying flash-memory technology designed to deliver deep-neural-network support on the edge using a fraction of the power needed by alternatives. The hybrid digital/analog array performs calculations with in the memory array where the network weights are stored. ADCs are used to read a memory cell’s voltage-variable conductance resulting in an 8-bit value rather than the one or two bits normally stored in a cell (Fig. 4). The architecture is designed to support ML models like those developed using TensorFlow.

4. Mythic drives its memory matrix with DACs and reads results using 8-bit ADCs.

The integration of ML in almost every application space is placing demands on hardware and software. These and other technologies are rising to meet the demand.

Sponsored Recommendations

The Importance of PCB Design in Consumer Products

April 25, 2024
Explore the importance of PCB design and how Fusion 360 can help your team react to evolving consumer demands.

PCB Design Mastery for Assembly & Fabrication

April 25, 2024
This guide explores PCB circuit board design, focusing on both Design For Assembly (DFA) and Design For Fabrication (DFab) perspectives.

What is Design Rule Checking in PCBs?

April 25, 2024
Explore the importance of Design Rule Checking (DRC) in manufacturing and how Autodesk Fusion 360 enhances the process.

Unlocking the Power of IoT Integration for Elevated PCB Designs

April 25, 2024
What does it take to add IoT into your product? What advantages does IoT have in PCB related projects? Read to find answers to your IoT design questions.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!