Xilinx Announces First Non-Volatile 90-nm FPGA Platform

Oct. 8, 2008
Targeting non-volatile applications where higher system integration or security is critical, the Spartan-3AN FPGA platform is built on the 90-nm Spartan-3 FPGA fabric and combines the performance and functionality advantages of SRAM-based technology

Targeting non-volatile applications where higher system integration or security is critical, the Spartan-3AN FPGA platform is built on the 90-nm Spartan-3 FPGA fabric and combines the performance and functionality advantages of SRAM-based technology with non-volatile flash technology in a single chip. Expanding on Device DNA technology, the Spartan-3AN offers a range of security features that safeguard against reverse engineering, cloning, and unauthorized overbuilding. Employing advanced serial flash technology, the FPGAs specify 20-year data retention and 100,000 write/erase cycles. A unique feature is dual-mode power management. In suspend mode, the device achieves more than 40% power reduction and wake up time of less than 100 ms, as well as system-level synchronization across time domains. In hibernate mode, it achieves up to 99% static power reduction. Five devices are available with configurations ranging from 50,000 to 1.4 million system gates, up to 576 Kb of block RAM, 16 Mb of embedded flash, and up to 502 I/Os supporting 26 popular I/O protocol standards. Engineering samples of the XC3S200AN, XC3S700AN, and XC3S1400AN are available now, with all five devices slated for production by the third quarter. They are expected to offer over 4,000 logic cells and 195 I/Os for approximately $4.90 each. XILINX INC., San Jose, CA. (408) 559-7778.

Company: XILINX INC.

Product URL: Click here for more information

Sponsored Recommendations

The Importance of PCB Design in Consumer Products

April 25, 2024
Explore the importance of PCB design and how Fusion 360 can help your team react to evolving consumer demands.

PCB Design Mastery for Assembly & Fabrication

April 25, 2024
This guide explores PCB circuit board design, focusing on both Design For Assembly (DFA) and Design For Fabrication (DFab) perspectives.

What is Design Rule Checking in PCBs?

April 25, 2024
Explore the importance of Design Rule Checking (DRC) in manufacturing and how Autodesk Fusion 360 enhances the process.

Unlocking the Power of IoT Integration for Elevated PCB Designs

April 25, 2024
What does it take to add IoT into your product? What advantages does IoT have in PCB related projects? Read to find answers to your IoT design questions.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!