FPGAs In CSP Meet MSL2 Specs

May 1, 2003
The eX family of field-programmable gate arrays (FPGAs) in chip-scale packaging (CSP) has recently received moisture-sensitivity level 2 (MSL2) certification. A JEDEC standard, MSL2 guarantees a one-year shelf life for packages stored at a fixed

The eX family of field-programmable gate arrays (FPGAs) in chip-scale packaging (CSP) has recently received moisture-sensitivity level 2 (MSL2) certification. A JEDEC standard, MSL2 guarantees a one-year shelf life for packages stored at a fixed temperature in an uncontrolled environment. The FPGA family includes the eX64, eX128 and eX256 with gate densities of 3,000, 6,000 and 12,000, respectively. The devices are available in a range of CSP, which include 49-, 128- and 180-ball packages. For further information, contact ACTEL CORP., Sunnyvale, CA. (888) 992-2835.

Company: ACTEL CORP.

Product URL: Click here for more information

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!