FPGAs In CSP Meet MSL2 Specs

May 1, 2003
The eX family of field-programmable gate arrays (FPGAs) in chip-scale packaging (CSP) has recently received moisture-sensitivity level 2 (MSL2) certification. A JEDEC standard, MSL2 guarantees a one-year shelf life for packages stored at a fixed

The eX family of field-programmable gate arrays (FPGAs) in chip-scale packaging (CSP) has recently received moisture-sensitivity level 2 (MSL2) certification. A JEDEC standard, MSL2 guarantees a one-year shelf life for packages stored at a fixed temperature in an uncontrolled environment. The FPGA family includes the eX64, eX128 and eX256 with gate densities of 3,000, 6,000 and 12,000, respectively. The devices are available in a range of CSP, which include 49-, 128- and 180-ball packages. For further information, contact ACTEL CORP., Sunnyvale, CA. (888) 992-2835.

Company: ACTEL CORP.

Product URL: Click here for more information

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