512-Mbit NAND Flash Leverages Dual-Die Packaging

Sept. 1, 1999
By packaging two single-level, 256-Mbyte NAND flash EEPROM die in TSOPs and SmartMedia cards, the company has achieved 512-Mbyte NAND flash densities. The 256-Mbyte NAND die on which these products are based uses 0.25-µm process technology and a

By packaging two single-level, 256-Mbyte NAND flash EEPROM die in TSOPs and SmartMedia cards, the company has achieved 512-Mbyte NAND flash densities. The 256-Mbyte NAND die on which these products are based uses 0.25-µm process technology and a shallow trench isolation cell, enabling greater storage capacity within a smaller area without sacrificing chip performance.The TC58512FT comes in TSOP Type I packaging, while the TC58512DC incorporates the firm’s SmartMedia packaging, providing 64 Mbytes of removable storage. Identical page and block specifications are used, making the SmartMedia devices fully backward-compatible with existing products. Both operate from a 3.3V supply.

Company: TOSHIBA AMERICA ELECTRONIC COMPONENTS INC. (TAEC)

Product URL: Click here for more information

Sponsored Recommendations

The Importance of PCB Design in Consumer Products

April 25, 2024
Explore the importance of PCB design and how Fusion 360 can help your team react to evolving consumer demands.

PCB Design Mastery for Assembly & Fabrication

April 25, 2024
This guide explores PCB circuit board design, focusing on both Design For Assembly (DFA) and Design For Fabrication (DFab) perspectives.

What is Design Rule Checking in PCBs?

April 25, 2024
Explore the importance of Design Rule Checking (DRC) in manufacturing and how Autodesk Fusion 360 enhances the process.

Unlocking the Power of IoT Integration for Elevated PCB Designs

April 25, 2024
What does it take to add IoT into your product? What advantages does IoT have in PCB related projects? Read to find answers to your IoT design questions.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!