DDR3 SDRAM Module Offers Ultra-Low Profile

Sept. 22, 2009
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Designed to satisfy demanding high-density memory applications for embedded, industrial, communication and networking, medical, and military and aerospace environments, the company’s DDR3 ultra-low-profile (ULP) registered DIMM stands just 17.75 mm (0.699 in.) in height. Surpassing JEDEC’s most stringent height requirements, this DDR3 ULP RDIMM is a candidate for compact server and small blade-server applications. The module’s small size enables engineers and designers to greatly reduce the area needed for host systems that require the performance of high-capacity registered memory modules working within severe height restriction requirements. Available in both commercial (0°C to +70°C) and industrial (-40°C to +85°C) temperature-grade versions, the module allows for further flexibility in its operating environment where cooling resources may be limited. The DDR3 Registered ECC ULP DIMM is fully compatible with JEDEC electrical specifications and is available in 4-GB and 2-GB densities at speeds of PC3-10600 (1333 Mbit), PC3-8500 (1066 Mbit), or PC3-6400 (800 Mbit). SWISSBIT AG, Bronschhofen, Switzerland. +41.71.913.03.03.


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