4 Mb SRAM Module Works In Space

Sept. 1, 1998
Using silicon-on-silicon technology, two SRAM die are stacked on each side of a dual-cavity ceramic quad flatpack with dimensions of less than one inch. The die are radiation hardened to a total dose hardness through 1 x 106 rads. The WS128K32-25G2MRH

Using silicon-on-silicon technology, two SRAM die are stacked on each side of a dual-cavity ceramic quad flatpack with dimensions of less than one inch. The die are radiation hardened to a total dose hardness through 1 x 106 rads. The WS128K32-25G2MRH 128K x 32 SRAM module is user-configurable as 256K x 16 or 512K x 8. The device has an access time of 25 ns and operates on 5V. The G2 package is a hermetic CQFP that conforms to the JEDEC 69-pin 0.990" footprint.

Company: WHITE ELECTRONIC DESIGNS CORP.

Product URL: Click here for more information

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!