SRAM Modules Taps Into CSP Technology

    Feb. 1, 2000
    These chip-scale package (CSP)-based memory modules are said to have the density of die-based modules but without the yield and manufacturing problems associated with memory die-based products. The PUMA68S16000XB is a 512K x 32 SRAM that is

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    These chip-scale package (CSP)-based memory modules are said to have the density of die-based modules but without the yield and manufacturing problems associated with memory die-based products. The PUMA68S16000XB is a 512K x 32 SRAM that is user-configurable as 8, 16 or 32 bits wide in a JEDEC standard 68 J-lead package.

    Company: MOSAIC SEMICONDUCTOR INC.

    Product URL: Click here for more information

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