Center-Probe Test Socket Handles Devices Up To 13 mm

Nov. 24, 2003

A center-probe test socket for devices up to 13 mm wide, with pitches of 0.50 mm and higher, operates from 1 to 10 GHz. Designed for CSP, MicroBGA, MLF, QFN, DSP, LGA, DRAM, and flash packages, it features a signal path during test of only 0.77 in....

Roger Allan

A four-point spring-probe crown ensures scrub-on solder-ball oxides for reliable contact mating. Additionally, the socket uses solderless pressure-mount compression spring probes accurately located by two molded plastic alignment pins and secured with four stainless-steel screws.

Center-probe contact forces are 9 to 12 g per contact for pitches from 0.50 to 0.75 mm and 17 to 20 g per contact for 0.80-mm pitches and larger. It operates from −55°C to 150°C. Spring probes are made of a heat-treated beryllium-copper alloy, plated with 30 µin. of gold minimum per MIL-G-45204 over 30 µin. of nickel per QQ-N-290. All socket components are made of UL94V0-0 or Torlon materials. All hardware is made of stainless steel.

Pricing for a 100-lead molded ball-grid-array socket (for up to 3 GHz) starts at $450 each in quantities of one to four pieces. Delivery is within two weeks.

Aries Electronics Inc.www.arieselec.com (908) 996-6841

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About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.