Digital ICs/DSP: Multichip Package Saves Space While Delivering 256 Mbytes

March 15, 2004

The W3E32M64S-XSBX, a 32-Mword by 64-bit double-data-rate (DDR) SDRAM module, packs 256 Mbytes of storage in a single 208-contact plastic ball-grid-array (BGA) package that measures 13 by 22 by 2.11 mm. Built by stacking four 512-Mbit DRAMs, the W3E32M64S-XSBX provides both high density and performance in one package. Each of its four memory chips is internally configured as a quad-bank DRAM. Data-rate speed grades of 200, 250, and 266 MHz are available. The package saves 73% more space than individual memory chips housed in TSOPs and 43% more than fine-pitch BGA packages. In lots of 500 units, the 256-Mbyte memory is priced at $250 apiece. Delivery takes four to six weeks after receipt of order.

White Electronic Designs Corp.www.whiteedc.com; (602) 437-1520

About the Author

Dave Bursky

Technologist

Dave Bursky, the founder of New Ideas in Communications, a publication website featuring the blog column Chipnastics – the Art and Science of Chip Design. He is also president of PRN Engineering, a technical writing and market consulting company. Prior to these organizations, he spent about a dozen years as a contributing editor to Chip Design magazine. Concurrent with Chip Design, he was also the technical editorial manager at Maxim Integrated Products, and prior to Maxim, Dave spent over 35 years working as an engineer for the U.S. Army Electronics Command and an editor with Electronic Design Magazine.