Database Finds Die Suppliers

June 24, 2002
A database created by the Die Products Consortium identifies the companies that supply semiconductor products in die form. Based on a survey of 350 semiconductor suppliers worldwide, the database aids the design and manufacture of multichip packages...

A database created by the Die Products Consortium identifies the companies that supply semiconductor products in die form. Based on a survey of 350 semiconductor suppliers worldwide, the database aids the design and manufacture of multichip packages by providing information on die availability early in the customer's design process. It does so by rapidly focusing the search for the availability of a particular die type to the relevant suppliers, who can then provide detailed product specifications.

The database permits searches by basic IC functions like ASIC, DSP, analog, or logic; die formats such as bumped, wirebond-ready, or chip-scale packaging; and shipping media including wafer trays, waffle packs, tape and reel, and others. In addition, it offers information on the authorized supply channels, Web links for more information, and company contacts.

Over time, the database will be expanded by increasing the number of suppliers profiled and by cross referencing the suppliers with the markets they serve. The latter feature accounts for the vast differences in die requirements among diverse applications. Other types of new information, which are not time-sensitive, may also be added. Beyond these activities, the consortium plans to develop a database of companies that can provide assembly services to users of die products. This database should be available by early September.

To view the database, go to www.dieproduct.com/die. Or for further details, call or e-mail Larry Gilg, managing director of the Die Product Consortium, at (512) 452-0077 or [email protected].

Sponsored Recommendations

TTI Transportation Resource Center

April 8, 2024
From sensors to vehicle electrification, from design to production, on-board and off-board a TTI Transportation Specialist will help you keep moving into the future. TTI has been...

Cornell Dubilier: Push EV Charging to Higher Productivity and Lower Recharge Times

April 8, 2024
Optimized for high efficiency power inverter/converter level 3 EV charging systems, CDE capacitors offer high capacitance values, low inductance (< 5 nH), high ripple current ...

TTI Hybrid & Electric Vehicles Line Card

April 8, 2024
Components for Infrastructure, Connectivity and On-board Systems TTI stocks the premier electrical components that hybrid and electric vehicle manufacturers and suppliers need...

Bourns: Automotive-Grade Components for the Rough Road Ahead

April 8, 2024
The electronics needed for transportation today is getting increasingly more demanding and sophisticated, requiring not only high quality components but those that interface well...

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!