RISC-Based Package Addresses High-End Apps

Poised for embedded applications such as missiles, aerospace, flight computers, fire-control systems, and critical systems, the WED3C755E8M-XBHX multi-chip package enlists the power of a 755 RISC processor (E die revision). The processor, in a 21 mm x 25 mm, 255 HiTCE BGA package, integrates a 1-MB SSRAM L2 cache configured as 128K x 72. It provides core and L2 cache frequencies of 300 MHz and 150 MHz or 350 MHz and 175 MHz, respectively, and a maximum 60x bus frequency of 66 MHz. Accommodating a range of operating environments, the package is available in commercial, industrial, and military temperature ranges. Price is $1,000 each/500 with a lead-time of eight to 10 weeks. WHITE ELECTRONIC DESIGNS CORP., Phoenix, AZ. (602) 437-1520.