Chip Packaging Part 2 - Introduction to IC Packaging

Feb. 13, 2021
Dr. Navid Asadi’s group delves into chip packaging methods including system-in-package (SIP)

View the TechXchange: Chip Packaging table of contents

Dr. Navid Asadi’s group examines chip packaging methods such as system-in-package (SIP). This is the second of a mutlipart series on chip packaging technologies.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!