• Resources
  • Directory
  • Webinars
  • CAD Models
  • Video
  • Blogs
  • EDGE Awards
  • Advertise
    1. Technologies
    2. Embedded

    Chip Packaging Part 6 - Wafer to Panel Level Packaging

    Feb. 4, 2021
    Dr. Navid Asadi’s group delves into wafer scale and panel level chip packaging.

    View the TechXchange: Chip Packaging table of contents

    Dr. Navid Asadi’s group takes a look at wafer to panel level chip packaging. This is the six of a mutlipart series on chip packaging technologies.

    Continue Reading

    Sponsored Recommendations

    Comments

    To join the conversation, and become an exclusive member of Electronic Design, create an account today!