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    Chip Packaging Part 4 - 2.5D and 3D Packaging

    Feb. 11, 2021
    Dr. Navid Asadi’s group examines 2.5D and 3D packaging for expanding capabilities and capacities of chip solutions

    View the TechXchange: Chip Packaging table of contents

    This is the fourth part of the series on  chip packaging technologies. In this episode, Dr. Navid Asadi’s group looks at 2.5D and 3D chip construction. 

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