Intel Foveros Technology Explained

Intel's chip packaging for processors goes 3D.

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Nov. 1, 2021

This is part of our Intel Innovation 2021 coverage.

Intel Innovation, Intel's new ON series developers conference, includes coverage of Intel's Foveros technology. Foveros utilizes wafer-level packaging to provide a "first-of-its-kind" 3D stacking solution. It will allow Intel to build processor stacks versus the current side-by-side approach to CPU chip packaging. It should provide greater performance in a smaller footprint.