Intel Foveros Technology Explained

Intel's chip packaging for processors goes 3D.
Nov. 1, 2021

This is part of our Intel Innovation 2021 coverage. 

Intel Innovation, Intel's new ON series developers conference, includes coverage of Intel's Foveros technology. Foveros utilizes wafer-level packaging to provide a "first-of-its-kind" 3D stacking solution. It will allow Intel to build processor stacks versus the current side-by-side approach to CPU chip packaging. It should provide greater performance in a smaller footprint. 

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