Designed for use in low-volume flip-chip production using gold, solder, adhesive or stud bumps, Model 860 Omni flip-chip bonder can be used on production lines or used as a benchtop station. An internal PC controls bond load, temperature profiles, process times and machine cycles to minimize operator involvement. Menus are displayed to help guide operators during setup and cycle operation. A strategically positioned joystick makes operation simple. The equipment aligns and attaches die sizes from 0.006" to 1" square at a throughput rate up to 200 placements/hr. with an accuracy of ±5 µm. Custom die trays can be accommodated.
Company: SEMICONDUCTOR EQUIPMENT CORP.
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