The VR7200 chip developed by Spectra7 Microsystems features highspeed active signal processing and a superthin cable to provide a more immersive virtualreality VR experience Image courtesy of Thinkstock

Dual-Screen VR Chip Boosts Bandwidth by 80%

Dec. 12, 2014
The VR7200 chip developed by Spectra7 Microsystems features high-speed, active signal processing and a super-thin cable to provide a more immersive virtual-reality (VR) experience.

Commercial availability of dual-screen, virtual-reality (VR) head-mounted displays could ramp up significantly with Spectra7 Microsystems’ latest chip development. Increasing bandwidth up to 80%, the VR7200 feeds dual ultra-high resolution displays that support resolutions over 500 pixels/in. in deep color at 80 frames/s, and at distances up to 5 m from the source.

Dual-screen VR offers a more immersive, broad field of view. However, it requires about twice the bandwidth of other VR systems and is typically burdened by multiple, thick passive cables. The VR7200 features high-speed, active signal processing and a single super-thin cable/ultra-compact connector combo to combat those issues. VR interconnects built with the chip are capable of dual 2560-by-1440 wide quad high definition (WQHD) display resolution at 4:4:4 Chroma at up to 80 frames/s per screen. Thanks to Luma or Chroma subsampling, there’s no image degradation. A separate, external HMD power connection is not required.

According to consulting firm KZero, the consumer VR market is expected to reach $5.2 billion by 2018, with an installed base of over 250 million VR-capable game consoles. Therefore, delivering differentiated products becomes necessary in order to appeal to the broadest consumer base. Dual-screen systems are thought to hold the potential to set an industry benchmark for immersive VR by reducing perceptible latency and delivering enhanced audio fidelity and video resolution.

About the Author

Iliza Sokol | Associate Content Producer

Iliza joined the Penton Media group in 2013 after graduating from the Fashion Institute of Technology with a BS in Advertising and Marketing Communications. Prior to joining the staff, she worked at NYLON Magazine and a ghostwriting firm based in New York.

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