Powerelectronics 4206 076061 Semiconductor

Automotive Power Integrated Module Solution for Next Generation Automotive BLDC Systems

Nov. 2, 2016
ON Semiconductor has expanded its portfolio of automotive Power Integrated Modules (PIMs) with the introduction of the STK984-190-E.

ON Semiconductor expanded its portfolio of automotive Power Integrated Modules (PIMs) with the introduction of the STK984-190-E. Optimized for driving 3-phase brushless DC motors in modern automotive applications, this module contains six 40 V, 30 A MOSFETs configured as a three-phase bridge with an additional 40 V, 30 A high-side reverse battery protection MOSFET. The MOSFETs are mounted onto a direct bonded copper (DBC) substrate, resulting in a compact module with excellent thermal performance taking up only half of the board space used by an equivalent discrete solution.

The module is suitable for use in 12 V automotive electric motor drive applications with power ratings up to 300 W, such as electric pumps, fans and windscreen wipers. Used in combination with motor controllers, such as LV8907UW, designers can build high efficiency BLDC solution with best in class thermal performance, built in diagnostics, and an ultra-small PCB that saves critical size and weight.

Using the module allows both the component count and the bill of materials costs to be reduced substantially. The DBC substrate reduces the thermal resistance, which reduces the operating temperature of the MOSFETs. This reduces power losses and increases reliability due to a reduced change in temperature during thermal cycling. Reliability is also improved by the isolation provided by the DBC substrate.  STK984-190-E has a specified operational temperature range of -40°C to 150°C. The integrated MOSFETs are all AEC-Q101 qualified.

The STK984-190-E is supplied in a Pb-free DIP-S3, measuring 29.6mm x 18.2mm x 4.3mm. It is priced at $7.00 per unit in 16-unit quantities. 

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