To save PCB space, reduce component counts, and simplify designs, the device uses an optimized package construction with two monolithically integrated TrenchFET Gen IV n-channel MOSFETs in a common-drain configuration. The SiSF20DN's source contacts are placed side by side, with enlarged connections increasing the contact area with the PCB and reducing resistivity further compared to conventional dual-package types. This design makes the MOSFET suitable for bidirectional switching in 24-V systems and industrial applications, including factory automation, power tools, drones, motor drives, white goods, robotics, security/surveillance, and smoke alarms.
Samples and production quantities of the new MOSFET are available now, with lead times of 30 weeks for larger orders. Pricing for U.S. delivery starts at $0.86 per piece in 10,000-piece quantities.