Monolithic Switcher ICs Available In Through-Hole Assembly Package

    May 27, 2002
    The TOPSwitch-GX family of high-power monolithic switcher ICs now offers a low-profile, through-hole assembly package option. Nine new devices, ranging in power up to 290 W, are available in the industry-standard TO-262 package for applications...

    The TOPSwitch-GX family of high-power monolithic switcher ICs now offers a low-profile, through-hole assembly package option. Nine new devices, ranging in power up to 290 W, are available in the industry-standard TO-262 package for applications where a TO-220 package is too high. The TOP242F version is rated at up to 22 W, and the TOP250F is rated at 290 W. Available now, the TOP242F and TOP250F cost $1.55 and $3.29 each, respectively, in 1000-unit lots.

    Power Integrations Inc.
    www.powerint.com; (408) 414-9200

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