MOSFET Combines Technologies, Improves Performance

July 1, 2003
Melding the company's SyncFET silicon technology into its flip leaded molded package (FLMP) yields the FDS7066SN3 MOSFET that promises lower on resistance and solid performance in dc/dc buck converter applications. In conjunction with an integrated

Melding the company's SyncFET silicon technology into its flip leaded molded package (FLMP) yields the FDS7066SN3 MOSFET that promises lower on resistance and solid performance in dc/dc buck converter applications. In conjunction with an integrated titanium Schottky diode, SyncFET technology claims to handle high power in reduced space. The 30V/19A n-channel MOSFET exhibits a typical on resistance of 4.5 milliohms at 10 VGS and a junction-to-case thermal resistance of 0.5ÞC/W. Other features include a reverse recovery gate charge of 28 nC and a reverse recovery time of 26.6 ns, both at IF=19A and di/dt=300 A/µs. Price is $2.14 each/1,000 with a delivery time of eight weeks ARO. FAIRCHILD SEMICONDUCTOR INTERNATIONAL, San Jose, CA. (888) 522-5372.

Company: FAIRCHILD SEMICONDUCTOR INTERNATIONAL

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