Low-Profile Package Houses 2200-µF Tantalum Capacitors

Jan. 23, 2009
Housed in a low-profile package, the high-capacitance PulseCap capacitor from AVX Corp. targets PCMCIA/USB wireless express cards and other applications where bulk capacitance is needed to boost transmitter power. These large-case-size tantalum products a

Housed in a low-profile package, the high-capacitance PulseCap capacitor from AVX Corp. targets PCMCIA/USB wireless express cards and other applications where bulk capacitance is needed to boost transmitter power (see the figure). These large-case-size tantalum products are rated at 2200 µF (2.2 mF) at 6.3 V. With their maximum 2-mm case height, they’re also ideal for reduced-height applications, according to the company. Other applications include wireless data cards, metering, and sensors.

Their undertab termination style, which replaces traditional J leads with terminations that don’t protrude outside the case’s outline, increases volumetric efficiency and enables parts to be positioned very closely together to deliver significant space savings. The PulseCap devices comply with the European Union’s Restrictions on Hazardous Substances (RoHS) and can withstand a soldering profile of 3x reflow at 260°C. Operating temperature ranges from –55°C to 125°C.

Pricing for these surface-mount devices typically starts at $2.20 each with availability in volume and a typical lead time of 14 weeks.

AVX Corp.

www.avx.com

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