Chips Provide Sync Rectification For DC-To-DC Converters

June 1, 1999
Meeting Intel's Mobile Power Guidelines 2000 specification, IRF7811 and IRF7809 HEXFET power MOSFET chipset for dc-to-dc converters achieves a 90% overall efficiency for the CPU core and peripheral converters recommended in the Intel guidelines. The

Meeting Intel's Mobile Power Guidelines 2000 specification, IRF7811 and IRF7809 HEXFET power MOSFET chipset for dc-to-dc converters achieves a 90% overall efficiency for the CPU core and peripheral converters recommended in the Intel guidelines. The chipset needs no paralleling devices and offers a small footprint despite current requirements of more than 12A peak. IRF7809 synchronous MOSFET uses an advanced trench process to minimize on-resistance and IRF7811 control MOSFET uses an advanced planar process for low gate charge and efficient high-frequency switching. The firm's CopperStrap interconnect technology provides thermal characteristics that allow high-efficiency heatsinking of the chip. This reportedly reduces junction operating temperatures by 20% compared with conventional packaging. On-resistance for IRF7811 is 9 milliohms at VGS = 4.5V and for IRF7809, 6 milliohms.

Company: INTERNATIONAL RECTIFIER CORP. (IR)

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