Electronicdesign 6669 1203npdtst

MEMS Accelerometer Combats Thermal/Mechanical Issues In Latest Portables

Dec. 3, 2013
A novel mechanical structure and dedicated processing applied to the LIS2HH13 three-axis accelerometer helps usher in consistent, stable high performance to withstand thermally challenging conditions inside today’s slimmer portable applications, according to developer STMicroelectronics.

A novel mechanical structure and dedicated processing applied to the LIS2HH13 three-axis accelerometer helps usher in consistent, stable high performance to withstand thermally challenging conditions inside today’s slimmer portable applications, according to developer STMicroelectronics. The device offers a selectable full-scale range of ±2, ±4, or ±8 g. Other features include a 16-bit digital output, integrated temperature sensor, I2C and SPI interfaces, 1.71- to 3.6-V analog supply-voltage range, and two programmable interrupt generators. Stability gets a boost with a typical Zero-g level change versus temperature of ±0.25 mg/°C. Rejection versus bending with a typical offset accuracy of ±30 mg represents a 25% improvement over existing solutions, says ST. Packaging is a 2- by 2- by 1-mm LGA-12. The LIS2HH3 is board- and software-compatible with the company’s LSM303C MEMS eCompass module, allowing OEMs to economically create differentiated handset products.

STMICROELECTRONICS

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!