The Toshiba Electronics Europe TC7761WBG wireless power receiver IC complies with Qi Standard Low Power Specifications version 1.1. It is fabricated with Toshiba’s combined CMOS-DMOS wafer process, which cuts heat generation to 70% that of an equivalent product while achieving 95% power conversion efficiency, according to the company.
The IC’s built-in protocol authentication circuit includes a foreign object detection (FOD) function, eliminates the need for an external microcontroller, and contributes to simplified system designs. The TC7761WBG also has been Qi certified for an output power of 3.5 W and can handle a maximum output power of 5 W. It will be used in wireless power supply applications such as smartphones and mobile accessories.