Microchip Technology
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High-Density Power Module Fits AI-at-the-Edge Applications

June 4, 2025
Microchip’s latest power module targeting AI systems includes integrated I2C and PMBus interfaces for flexible configuration and monitoring.

The MCPF1412 from Microchip Technology is a high-efficiency, fully integrated point-of-load 12-A power module integrating a 16-V VIN buck converter and support for I2C and PMBus interfaces. Its compact form factor of 5.8 × 4.9 × 1.6 mm and innovative land-grid-array (LDA) package reduce required board space by over 40% compared to traditional discrete solutions.

The module supports standalone operation without a digital interface, allowing designers to easily configure output voltages using simple resistor-divider adjustments and monitor the system via the Power Good output. Other key features of the MCPF1412 include multiple diagnostic functions such as overtemperature, overcurrent, and overvoltage protection for improved performance and reliability. An on-board embedded EEPROM is available for programming the default power-up configuration.

The MCPF1412 is supported by the EV37R94A Evaluation Board and GUI to help developers evaluate their design. The module is available for $5.10 each in 10,000-unit quantities. To learn more about Microchip’s power modules, visit the company's product info page.

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About the Author

Lee Goldberg | Contributing Editor

Lee Goldberg is a self-identified “Recovering Engineer,” Maker/Hacker, Green-Tech Maven, Aviator, Gadfly, and Geek Dad. He spent the first 18 years of his career helping design microprocessors, embedded systems, renewable energy applications, and the occasional interplanetary spacecraft. After trading his ‘scope and soldering iron for a keyboard and a second career as a tech journalist, he’s spent the next two decades at several print and online engineering publications.

Lee’s current focus is power electronics, especially the technologies involved with energy efficiency, energy management, and renewable energy. This dovetails with his coverage of sustainable technologies and various environmental and social issues within the engineering community that he began in 1996. Lee also covers 3D printers, open-source hardware, and other Maker/Hacker technologies.

Lee holds a BSEE in Electrical Engineering from Thomas Edison College, and participated in a colloquium on technology, society, and the environment at Goddard College’s Institute for Social Ecology. His book, “Green Electronics/Green Bottom Line - A Commonsense Guide To Environmentally Responsible Engineering and Management,” was published by Newnes Press.

Lee, his wife Catherine, and his daughter Anwyn currently reside in the outskirts of Princeton N.J., where they masquerade as a typical suburban family.

Lee also writes the regular PowerBites series

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