Electronic Design
  • Resources
  • Directory
  • Webinars
  • CAD Models
  • Video
  • Blogs
  • More Publications
  • Advertise
    • Search
  • Top Stories
  • Tech Topics
  • Analog
  • Power
  • Embedded
  • Test
  • AI / ML
  • Automotive
  • Data Sheets
  • Topics
    - TechXchange Topics --- Markets --AutomotiveAutomation-- Technologies --AnalogPowerTest & MeasurementEmbedded
    Resources
    Electronic Design ResourcesTop Stories of the WeekNew ProductsKit Close-UpElectronic Design LibrarySearch Data SheetsCompany DirectoryBlogsContribute
    Members
    ContentBenefitsSubscribeDigital editions
    Advertise
    https://www.facebook.com/ElectronicDesign
    https://www.linkedin.com/groups/4210549/
    https://twitter.com/ElectronicDesgn
    https://www.youtube.com/channel/UCXKEiQ9dob20rIqTA7ONfJg
    1. Technologies
    2. Power
    3. Power Supply
    4. Discrete Power Semis

    30 V P-Channel Chipscale MOSFETs

    April 11, 2012
    Vishay Intertechnology, Inc. expanded its MICRO FOOT® TrenchFET® Gen III power MOSFET family with two p-channel 30 V devices that set new benchmarks for size and on-resistance.

    Vishay Intertechnology, Inc. expanded its MICRO FOOT® TrenchFET® Gen III power MOSFET family with two p-channel 30 V devices that set new benchmarks for size and on-resistance. The new Si8497DB is the industry's first 30 V chipscale MOSFET in the compact 1 mm by 1.5 mm size, making it the smallest such device on the market, while the Si8487DB provides the lowest on-resistance available for a 30 V chipscale device in the 1.6 mm by 1.6 mm form factor.

    Vishay's TrenchFET Gen III p-channel technology uses advanced process techniques to pack one billion transistor cells into each square inch of silicon. This leading-edge technology allows a superfine, sub-micron pitch process that cuts the industry's best on-resistance for a p-channel MOSFET by up to half. Chipscale MICRO FOOT technology allows the use of a larger die for a given outline, which means a lower on-resistance for a given device area, in addition to space savings to enable smaller, slimmer end products.

    The Si8497DB and Si8487DB will be used for load, battery, and charger switching in handheld devices including smart phones, tablets, point-of-sale (POS) devices, and mobile computing. In laptop battery management circuits, the MOSFETs' low on-resistance translates into lower voltage drops across the load switch, which in turn reduces the occurrence of problem undervoltage lockouts. In charger applications for tablet PCs, smart phones, and POS devices, the low on-resistance means that higher charge currents can be used, facilitating faster battery charging.

    For designers, the Si8487DB and Si8497DB provide a choice between size and on-resistance to meet the needs of their specific application. Where space is at a premium, the 1.5 mm x 1 mm Si8497DB combines a slim 0.59 mm maximum height with low on-resistance of 53 mΩ at 4.5 V, 71 mΩ at 2.5 V, and 120 mΩ at 2.0 V. In applications where low on-resistance is essential, the Si8487DB offers on-resistance of 31 mΩ at 10 V, 35 mΩ at 4.5 V, and 45 mΩ at 2.5 V, and a 0.6 mm maximum height, the industry's lowest on-resistance values for such a p-channel power MOSFET.

    The devices are halogen-free in accordance with the IEC 61249-2-21 definition and compliant to RoHS Directive 2002/95/EC. The Si8487DB is pin compatible with Vishay's 30 V Si8409DB.

    Samples and production quantities of the new Si8487DB and Si8497DB TrenchFET power MOSFET are available now, with lead times of 12 weeks for larger orders. Pricing for U.S. delivery starts at $0.12 per piece in 100,000-piece quantities.

    Continue Reading

    Arm Unveils Its Most Compact AI-Capable Cortex-M CPU

    Products of the Week: IoT-Focused NOR Flash, Compact Radar Sensor

    Sponsored Recommendations

    Comments

    To join the conversation, and become an exclusive member of Electronic Design, create an account today!

    I already have an account

    New

    Arm Unveils Its Most Compact AI-Capable Cortex-M CPU

    Welcome to GoPro Warfare

    Lead-Free Quantum Dots Bring SWIR Closer to Consumers

    Most Read

    Edge AI Opportunities Abound at embedded world

    April 1st, 2023 @ Electronic Design

    Robotic Delivery System Takes Flight


    Sponsored

    8MS8 Series Multi-Channel I/O Twin Axial Cable Assemblies

    Flux Field Directional Materials for NFC/RFID and Wireless Power Applications

    MasterGan 1,2

    Electronic Design
    https://www.facebook.com/ElectronicDesign
    https://www.linkedin.com/groups/4210549/
    https://twitter.com/ElectronicDesgn
    https://www.youtube.com/channel/UCXKEiQ9dob20rIqTA7ONfJg
    • About Us
    • Contact Us
    • Advertise
    • Do Not Sell or Share
    • Privacy & Cookie Policy
    • Terms of Service
    © 2023 Endeavor Business Media, LLC. All rights reserved.
    Endeavor Business Media Logo