P-Channel PowerTrench® WL-CSP MOSFETs Minimize Board Space
June 11, 2012
Fairchild Semiconductor developed the FDZ661PZ and FDZ663P P-channel, 1.5V specified PowerTrench® Thin 0.8mm x 0.8mm WL-CSP MOSFETs.
Fairchild Semiconductor developed the FDZ661PZ and FDZ663P P-channel, 1.5V specified PowerTrench® Thin 0.8mm x 0.8mm WL-CSP MOSFETs. Using a state-of-the-art "fine pitch," thin WL-CSP packaging process, these devices minimize board space and RDS(ON), while achieving excellent thermal characteristics for a miniature form factor.
Features:
0.8 x 0.8mm packaging occupies only 0.64mm² of PCB area, less than 16% of the area of a 2mm x 2mm CSP
Less than 0.4mm height when mounted to PCB
Low R DS(ON) ratings with VGS as low as -1.5V
RθJA of 93ºC/W, on 1in² 2oz. copper pad
RoHS-compliant
Suitable for use in battery management and load switch functions in mobile applications
