P-Channel PowerTrench® WL-CSP MOSFETs Minimize Board Space

Fairchild Semiconductor developed the FDZ661PZ and FDZ663P P-channel, 1.5V specified PowerTrench® Thin 0.8mm x 0.8mm WL-CSP MOSFETs.
June 11, 2012

Fairchild Semiconductor developed the FDZ661PZ and FDZ663P P-channel, 1.5V specified PowerTrench® Thin 0.8mm x 0.8mm WL-CSP MOSFETs. Using a state-of-the-art "fine pitch," thin WL-CSP packaging process, these devices minimize board space and RDS(ON), while achieving excellent thermal characteristics for a miniature form factor.

Features:

  • 0.8 x 0.8mm packaging occupies only 0.64mm² of PCB area, less than 16% of the area of a 2mm x 2mm CSP
  • Less than 0.4mm height when mounted to PCB
  • Low R DS(ON) ratings with VGS as low as -1.5V
  • RθJA of 93ºC/W, on 1in² 2oz. copper pad
  • RoHS-compliant
  • Suitable for use in battery management and load switch functions in mobile applications
  • Price: US $ in 1,000 quantity pieces
  • FDZ661PZ: $0.26
  • FDZ663P: $0.26
  • Availability: Samples available upon request.
  • Delivery: 8-12 weeks ARO

Fairchild Semiconductor
Part Number: FDZ6663P

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