Electronic Design
  • Resources
  • Directory
  • Webinars
  • CAD Models
  • Video
  • Blogs
  • More Publications
  • Advertise
    • Search
  • Top Stories
  • Tech Topics
  • Analog
  • Power
  • Embedded
  • Test
  • AI / ML
  • Automotive
  • Data Sheets
  • Topics
    - TechXchange Topics --- Markets --AutomotiveAutomation-- Technologies --AnalogPowerTest & MeasurementEmbedded
    Resources
    Electronic Design ResourcesTop Stories of the WeekNew ProductsKit Close-UpElectronic Design LibrarySearch Data SheetsCompany DirectoryBlogsContribute
    Members
    ContentBenefitsSubscribeDigital editions
    Advertise
    https://www.facebook.com/ElectronicDesign
    https://www.linkedin.com/groups/4210549/
    https://twitter.com/ElectronicDesgn
    https://www.youtube.com/channel/UCXKEiQ9dob20rIqTA7ONfJg
    1. Technologies
    2. Power
    3. Power Supply
    4. Discrete Power Semis

    P-Channel PowerTrench® WL-CSP MOSFETs Minimize Board Space

    June 11, 2012
    Fairchild Semiconductor developed the FDZ661PZ and FDZ663P P-channel, 1.5V specified PowerTrench® Thin 0.8mm x 0.8mm WL-CSP MOSFETs.

    Fairchild Semiconductor developed the FDZ661PZ and FDZ663P P-channel, 1.5V specified PowerTrench® Thin 0.8mm x 0.8mm WL-CSP MOSFETs. Using a state-of-the-art "fine pitch," thin WL-CSP packaging process, these devices minimize board space and RDS(ON), while achieving excellent thermal characteristics for a miniature form factor.

    Features:

    • 0.8 x 0.8mm packaging occupies only 0.64mm² of PCB area, less than 16% of the area of a 2mm x 2mm CSP
    • Less than 0.4mm height when mounted to PCB
    • Low R DS(ON) ratings with VGS as low as -1.5V
    • RθJA of 93ºC/W, on 1in² 2oz. copper pad
    • RoHS-compliant
    • Suitable for use in battery management and load switch functions in mobile applications
    • Price: US $ in 1,000 quantity pieces
    • FDZ661PZ: $0.26
    • FDZ663P: $0.26
    • Availability: Samples available upon request.
    • Delivery: 8-12 weeks ARO

    Fairchild Semiconductor
    Part Number: FDZ6663P

    Continue Reading

    New EV-Focused MOSFETs Come in Compact Packages

    eBook: How Material Selection Can Make or Break your PCB

    Sponsored Recommendations

    Designing automotive-grade camera-based mirror systems

    Dec. 2, 2023

    Design security cameras and other low-power smart cameras with AI vision processors

    Dec. 2, 2023

    Automotive 1 TOPS vision SoC with RGB-IR ISP for 1-2 cameras, driver monitoring, dashcams

    Dec. 2, 2023

    AM62A starter kit for edge AI, vision, analytics and general purpose processors

    Dec. 2, 2023

    Comments

    To join the conversation, and become an exclusive member of Electronic Design, create an account today!

    I already have an account

    New

    Bob Pease on Analog Vol. 3

    Environmental Sensors Target Air Quality

    Whitepaper: IoT Connectivity Considerations and Wi-Fi 6E

    Most Read

    Celebrating Field Engineers: The Unsung Heroes of Innovation

    More Bob Pease on Analog

    2023 Nobel Prizes for Physics and Chemistry Have Direct EE Relevance


    Sponsored

    Understanding SOA Curves to Operate at High Output Currents and Temperature

    Reduce EMI and shrink solution size with Hot Rod packaging

    Accurately measure vital signs with low Iq and a small form factor

    Electronic Design
    https://www.facebook.com/ElectronicDesign
    https://www.linkedin.com/groups/4210549/
    https://twitter.com/ElectronicDesgn
    https://www.youtube.com/channel/UCXKEiQ9dob20rIqTA7ONfJg
    • About Us
    • Contact Us
    • Advertise
    • Do Not Sell or Share
    • Privacy & Cookie Policy
    • Terms of Service
    © 2023 Endeavor Business Media, LLC. All rights reserved.
    Endeavor Business Media Logo