Powerelectronics 2920 120814xrel

High-Temperature Crystal Oscillator Driver

Dec. 10, 2014
X-REL Semiconductor has broadened its clock and timing product line by introducing a low-power, small foot-print crystal oscillator driver, XTR60010.

X-REL Semiconductor has broadened its clock and timing product line by introducing a low-power, small foot-print crystal oscillator driver, the XTR60010. Intended for operation in high-reliability, extreme temperature and extended lifetime systems, the XTR60010 is specially tailored for crystal oscillators, clock generation, clock buffering, frequency division and precision timing applications, with supply voltages from 2.5 V to 5.5 V and with crystals from 32 kHz to 50 MHz.

Several functional features have been implemented in the XTR60010 to minimize bill-of-material (BoM) and ease adoption, such as automatic gain control of crystal driver, on-chip crystal load capacitors, customer selectable prescaler and programmable frequency divider. This reduction in area and bill-of-material (BoM), together with the ability to adapt to the used crystal without the need for customer intervention, provides a drastic reduction in system complexity, cost and development time, greatly accelerating product qualification cycles and time-to-market.

As with all other X-REL Semiconductor products, the XTR60010 is able to reliably operate well below and above the -60 °C to +230 °C (5 years at +230 °C) temperature range. Being operational at high temperatures is mandatory not only in applications where the environment is at elevated temperature, but also where self-heating of devices within the system increases the temperature inside the application casing. Additionally, all X-REL Semiconductor products can be used in applications running at lower temperatures (e.g. from 100 °C to 200 °C) where extended lifetime is expected or where failing is not an option. For example, the expected lifetime of X-REL Semiconductor parts in a driver application operating at Tj=150 °C is over 35 years.

XTR60010 devices are already available and can be immediately deployed in niche and large-scale markets in high-reliability compact hermetic or plastic packages, as well as bare dice.

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