Powerelectronics 3542 045043 Molex Incorporated Format
Powerelectronics 3542 045043 Molex Incorporated Format
Powerelectronics 3542 045043 Molex Incorporated Format
Powerelectronics 3542 045043 Molex Incorporated Format
Powerelectronics 3542 045043 Molex Incorporated Format

Molex Flex Circuit Assemblies Deploy DuPont™ Pyralux® TK Flexible Circuit Material

July 22, 2015
Molex Incorporated introduced its new High-Speed Low-Loss Flex Circuit Assemblies, made using DuPont™ Pyralux® TK flexible circuit material.

Molex Inc. has introduced new High-Speed Low-Loss Flex Circuit Assemblies, made using DuPont™ Pyralux® TK flexible circuit material.  The assemblies are ideal for electronic data transmission applications such as servers and high-end computing, storage servers and signal processing.

With this release, Molex has become one of the first manufacturers to incorporate DuPont™ Pyralux® TK flexible circuit material into the volume production of multi-layer flexible circuit constructions.  Pyralux® TK is a double-sided flexible copper clad laminate and bonding film system formulated with DuPont™ Teflon® fluoropolymer film and DuPont™ Kapton® polyimide film.  It provides exceptional electrical performance for high speed digital and high frequency flexible circuit applications. The dielectric constant and low-loss capabilities of Pyralux® TK deliver a mechanically flexible construction, tighter bend radii and faster transmission than standard flexible assemblies.

Molex High-Speed Low-Loss Flex Circuit Assemblies are available with self-coiling or mechanically-assisted coiling, offering options for flexible three dimensional packaging, minimizing insertion loss and providing improved airflow compared to a standard PCB design. 

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