Goepel Debuts 3-D X-Ray Software for OptiCon XI-Pilot 3.0
May 16, 2012. GOEPEL electronic has introduced its new OptiCon XI-Pilot 3.0 X-ray inspection system software. The new software, running on the OptiCon X-Line 3-D x-ray inspection system, enables a higher image recording speed at increased sensitivity. Additionally, new features compensate for PCB warpage and support automatic stability control of the image sequence.
GOEPEL reports that a true to height reconstruction of PCB layers in which solder joints are accurately situated is a prerequisite for solder-joint analyses, adding that a 3-D X-ray inspection (AXI) system must detect and compensate for PCB warpage or waved surfaces. GOEPEL's software employs a method that detects and compensates for PCB slag during the inspection process. The result is a true-to-height solder-layer reconstruction that supports high-quality evaluation of solder joints. Based on PCB condition, it is possible to select whether the entire assembly or each partial circuit of a value should be compensated. For PCB warpage determination, a laser triangulation sensor can be applied. It is also possible to compensate for PCB slag directly in the recorded images using software algorithms.
An X-ray inspection system image sequence generally consists of a source for X-ray emission and a detector to convert radiation weakened by the UUT into visible light. Natural ageing processes of these components change grey values in the x-ray images, which may lead to faults in algorithmic evaluation of solder joints. GOEPEL says its software automatically detects changes in the X-ray image chain and re-calibrates as required, thereby guaranteeing constant image quality and measurement values in the system during the inspection process.