EAG touts capabilities at SEMICON West

San Francisco, CA. Representatives of the Evans Analytical Group were on hand at SEMICON West to highlight their company's capabilities. Aram Sarkissian noted that EAG has three divisions with about 700 employees serving more than 5,500 customers in the industrial, aerospace, LED, solar, biomed, pharma, chemical, consumer, and technology end markets.

Sarkissian's His primary focus at SEMICON West was the Microelectronics, Test, and Engineering (MTE) division, which provides outsourced testing and failure-analysis services to semiconductor companies and for which he serves as general manager.

He noted that the company's Materials Characterization (MC) division, which provides microanalytical surface testing and analysis of materials, would also have applicability to SEMICON West attendees. The third division, Environmental Fate, Chemistry, and Ecotoxicology, focuses on technical analyses and registration requirements for the agrochemical, industrial chemical, pharmaceutical and animal health Industries.

The MTE group, he said, has an engineering staff of more than 150 and more than $75 million worth of capital equipment. The division offers ATE test development and pilot production test, burn-in and reliability qualification, ESD and latch-up testing, debug and FIB circuit edit, failure analysis, microscopy (including SEM, TEM, and FIB/SEM), and PCB design and hardware.

The division, he said, offers a multidisciplinary approach that enables its engineers to choose the right tools and platforms to meet customer needs. “We bring together the right elements to best serve the customer, integrating multitechnology, multivendor platforms benefitting from our world-class solutions,” he said.

Of particular emphasis at SEMICON West was the division's work with respect to chip-scale packaging, said Taqi Mohiuddin, senior director of sales and marketing. Chip-scale packages are finding use in fast growing markets for tablets, smartphones, and other consumer products. “The packages are getting smaller, and the qualification challenge is getting larger,” he said.

Mohiuddin noted that CSPs are prone to damage from mishandling that often occurs getting the packages in and out of sockets, making it difficult to perform incoming and outgoing quality inspections. EAG can train operators and technicians in the proper handling of the packages—using an electric vacuum pen, for example. The company also provides 100% top and bottom visual inspection of units to screen out damaged parts before subjecting them to temperature, pressure, humidity, and other stresses. Mohiuddin added that EAG can also design custom test fixtures and carriers. He has on hand one carrier that can hold up to 240 parts and is rated from -55 to +260°C.

“A solution can be designed and customized to meet customer-specific needs and ensure successful outcomes,” he concluded.

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