Isola Group, a provider of copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced today the introduction of IS350MD, which expands the company’s portfolio of halogen-free laminates and prepregs for high-end mobile applications. IS350MD fits between Isola’s established standard dielectric constant (Dk) material, DE156, and the company’s ultralow Dk material, IS300MD, which was introduced in 2014 and gained momentum in the high density interconnect (HDI) market.
The demand for faster processing and more efficient designs in smartphones and tablets is driving the need for thinner, more powerful PCBs. These thin PCBs require low-Dk laminate materials to meet the impedance requirements of these advanced designs. IS350MD with a Dk of 3.51 was engineered specifically for these types of ultrathin dielectric applications.
IS350MD is an FR-4 type base material with a resin matrix; it is based on a modified epoxy resin reinforced with conventional E-glass fabric. The requirements of flammability class V-0 per UL-94 are met without the addition of antimony compounds. As the IS350MD material does not contain halogens, it displays greater thermal stability than a standard FR-4, as demonstrated in its Time to Delamination (T288) measurements.
IS350MD is engineered for ease of manufacturing. IS350MD laminate and prepreg can be tailored to any thickness to meet the needs of the latest multilayer HDI buildup technologies. It requires a short press cycle and, similar to FR-4 materials, it does not require plasma for desmearing, making it suitable for HDI mobile applications, while providing a very competitive low cost of total ownership.
Tarun Amla, executive vice president and chief technology officer, at Isola stated, “With the introduction of IS350MD, Isola now has the broadest Dk offering for HDI applications. From DE156 with a Dk of 4.00 to IS350MD’s Dk of 3.51 to IS300MD’s Dk of 3.06, designers now have a wide selection of halogen-free materials to optimize their PCB designs.”