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IMS sees chips and instruments targeting mmWave applications

July 22, 2016

The International Microwave Symposium 2016 was held in late May in San Francisco. At a press conference early in the week, Keysight Technologies highlighted its long-term relationship with Cascade Microtech. On the show floor, Keysight focused on the X-Series signal analyzers, the CX3300 Series device current waveform analyzers, and an E-band testbed solution.

As for software, Keysight featured the EEsof EDA SystemVue 2016 release, which includes a phased-array library and a 5G baseband verification library. In addition, the company presented Advanced Design System 2016, Genesys circuit-synthesis software, and EMPro 3D electromagnetic simulation software.

National Instruments highlighted a number of innovations, including advanced millimeter wave (mmWave) technology for channel sounding and 5G prototyping as well as advanced solutions for RFIC test from lab-based characterization systems to high-volume manufacturing test solutions using the NI Semiconductor Test System.

NI said a new EM Socket II architecture within NI AWR Design Environment has been developed. The latest release of an AWR Connected solution is for ANSYS’s HFSS software. In addition, Sonnet Software and Computer Simulation Technology tools have been upgraded from prior EM Socket implementations to the new format.

Also, NI demonstrated an early-access version of its WLAN Measurement Suite with support for the IEEE 802.11ax (draft 0.1) high-efficiency wireless draft stand­ard and highlighted a software-defined radio for the mmWave spectrum. The new NI mmWave Transceiver System can transmit and receive 2-GHz real-time-bandwidth signals.

Anritsu highlighted its VectorStar and ShockLine vector network analyzer families. The company showed a measurement system featuring the VectorStar MS4640B VNA and the MG3710A RF signal generator that conducted modulated measurements.

Rohde & Schwarz exhibited its R&S TS-5GCS 5G channel sounding software plus an R&S FSW signal and spectrum analyzer and an R&S SMW200A vector signal generator. The R&S SMW200A has a frequency range of up to 40 GHz and is used as the sounding signal source. The company also demonstrated its ARTS9510 automotive radar target simulator.

Rigol Technologies emphasized EMI precompliance test. The company highlighted its NFP-3 Series near-field probes as well as updated EMI Test System Software, which can be used with any Rigol DSA Series spectrum analyzer to configure and collect data from precompliance test, including radiated and conducted emissions sweeps.

Tektronix, too, addressed EMI, exhibiting the RSA500 Series portable spectrum analyzers, which bring lab performance levels to the field. The company also showed the MDO4000C, which can assist with EMI/EMC precompliance test.

AR focused on EW, wireless, and EMC testing. Products on exhibit included the 350S1G6 amplifier as well as the 300S1G6AB and other AB modules.

Pickering Interfaces showcased its line of PXI and LXI RF and microwave switching solutions, including the newly announced PXI RF multiplexer (Model 40-760). Pickering’s RF and microwave switching solutions extend from low-level DC to signal bandwidths up to 65 GHz.

In addition, Averna highlighted a PIM test system, MathWorks described its approach to next-generation wireless design, Copper Mountain Technologies demonstrated USB VNAs and reflectometers, Mini-Circuits showed an RF test system, Pico Technology presented a USB oscilloscope that delivers the functionality of six instruments, and Wireless Telecom Group’s Boonton and Noisecom divisions highlighted power sensors and programmable precision carrier-to-noise generators, respectively. Also on the test-equipment front, Eastern OptX featured its radar target simulator, which operates up to 40 GHz with a dynamic range of greater than 100 dB.

Semiconductor companies also had a significant presence at IMS. Northrop Grumman, for example, highlighted several new semiconductor products including high-power amplifiers and enhanced GaN manufacturing options.

In addition, Analog Devices debuted its RadioVerse technology and design ecosystem; NXP highlighted communications, defense, and medical applications; Peregrine introduced several high-frequency products including an image-reject mixer; Qorvo focused on new small-cell PAs and touted ultra-wideband linearization results; and Wolfspeed demonstrated GaN HEMT devices.

Companies also addressed cables, connectors, and components. MegaPhase highlighted its KillerBee test cable, which operates from DC to 40 GHz, and exhibited its Warrior cable, a rugged RF cable that provides long-term repeatable performance in extreme operating conditions.

Huber+Suhner exhibited its new SUCOFLEX 500V, a VNA test assembly. The company demonstrated the quality and stability vs. temperature and flexure of the SUCOFLEX 500V by placing the assemblies on a bending machine and taking measurements on a network analyzer.

W. L. Gore & Associates highlighted its expanded microwave/RF solutions that offer enhanced performance in the 60- to 70-GHz range, where there is increased need to maintain measurement accuracy when performing communications testing with network analyzers, oscilloscopes, and analog signal generators.

Molex featured applications including radar, automotive, and cellular communications. The company highlighted its portfolio of RF/microwave connectors and cable assemblies, including more than 90 RF connector interface types.

Microwave Products Group, a Dover company, presented a booth hosting several of its subsidiaries, including Dow-Key Microwave and K&L Microwave. The latter highlighted its RF and microwave filters, duplexers, and integrated assemblies. Dow-Key exhibited its Reliant Switch product series.

JFW Industries featured its range of attenuators, RF switches, power dividers, and test accessories. Cobham exhibited a variety of products, including spiral and broadband antennas, flat plate antennas, mmWave converters, limiters and detectors, switch matrices, integrated microwave assemblies, synthesizers, signal converters, and RF interconnects.

And Diamond Microwave demonstrated a range of X-band GaN-based pulsed solid-state power amplifiers offering integrated monitoring and protection. The new product range offers output power levels up to 300 W and a footprint of 220 x 150 x 41 mm excluding heatsink.

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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