When it comes to ensuring printed-circuit-board quality, reliability, and functionality, you have a variety of techniques from which to choose—JTAG technology, AOI, AXI, flying-probe test, in-circuit test, and functional test—and your application may require the adoption of some or even all of these. Bare-board test and inspection are places to start.
When it comes to adding components, to the extent possible, you’ll want to design JTAG components into your board. JTAG, with the help of a standalone controller from a JTAG vendor, and help you bring-up and debug your board, and in production you can administer JTAG tests through an in-circuit tester.
AOI and AXI also have a role to play. For example, you can deploy AOI for solder-paste inspection as well as pre- and post-reflow. Finally, you can make use of functional electrical test. And for various stages, to get signals to and from your DUT you’ll need connectivity—ranging from a simple JTAG TAP connector to a complex in-circuit test fixture.
We will be elaborating on board test and inspection technologies in the February 2017 issue of EE-Evaluation Engineering with an article that will include highlights of what vendors plan to exhibit at IPC APEX EXPO February 11-16, 2017, in San Diego.
We welcome your input for this article and invite your responses to one or more of the questions below:
- What PCT test and inspection challenges have you identified recently, and how have you solved them?
- If you are planning to exhibit at IPC APEX EXPO, what products or services do you plan to highlight?
- If you are a test or inspection equipment vendor, what is significant or unique about your products?
Send me your responses at [email protected]. We need to receive replies by November 30, 2016. Thanks for your help.
