MEMSIC introduces 3-axis magnetic sensor

Dec. 7, 2016

Andover, MA. MEMSIC Inc. today announced the availability of the MMC5883MA 3-axis magnetic sensor. The newest member of MEMSIC’s anisotropic magnetoresistive (AMR)-based magnetic sensor family, it provides accuracy, low noise, and low power consumption, all combined in an industry-standard small LGA package. It addresses the ever-increasing demands of industrial and drone applications.

Dr. Yang Zhao, MEMSIC’s chairman, president, and CEO said, “With more than 300 million units shipped, MEMSIC has a long history of success with its AMR magnetic sensor in a wide range of critical portable and wearable applications. Integrating innovative design architecture and optimized processes, MEMSIC’s new 3-axis, ±8 Gauss full-scale-range (FSR) MMC5883MA provides a reliable, high-performance solution for industrial and drone system design and development engineers who need to provide stability and direction sensing for their designs.”

The MEMSIC MMC5883MA provides 16-bit operation over a ± 8-Gauss operating range with linearity of ±0.2% FSR, hysteresis of 0.2% FSR, and repeatability of 0.2% FSR on each of its three axes. Its high performance enables faster algorithms for hard and soft iron interference correction delivering more precise and faster heading determination. The low-profile LGA package measures 3.0 x 3.0 x 1.0 mm and operates over the -40 to + 85°C temperature range from a supply voltage of 2.16 to 3.6 V. It exhibits low current consumption of only 20 μA at a 7-S/s data rate and a low noise level of only 0.4 mGauss total RMS.

The MC5883MA is complete system incorporating on-chip signal processing and an integrated I2C 400-kHz FAST mode operation digital interface for direct connectivity to the system microprocessor. Devices premounted on prototyping boards can be purchased directly from MEMSIC. Designers can evaluate and log data using MEMSIC’s Universal Evaluation Board.

www.memsic.com

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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