MEMSIC introduces 3-axis magnetic sensor
Andover, MA. MEMSIC Inc. today announced the availability of the MMC5883MA 3-axis magnetic sensor. The newest member of MEMSIC’s anisotropic magnetoresistive (AMR)-based magnetic sensor family, it provides accuracy, low noise, and low power consumption, all combined in an industry-standard small LGA package. It addresses the ever-increasing demands of industrial and drone applications.
Dr. Yang Zhao, MEMSIC’s chairman, president, and CEO said, “With more than 300 million units shipped, MEMSIC has a long history of success with its AMR magnetic sensor in a wide range of critical portable and wearable applications. Integrating innovative design architecture and optimized processes, MEMSIC’s new 3-axis, ±8 Gauss full-scale-range (FSR) MMC5883MA provides a reliable, high-performance solution for industrial and drone system design and development engineers who need to provide stability and direction sensing for their designs.”
The MEMSIC MMC5883MA provides 16-bit operation over a ± 8-Gauss operating range with linearity of ±0.2% FSR, hysteresis of 0.2% FSR, and repeatability of 0.2% FSR on each of its three axes. Its high performance enables faster algorithms for hard and soft iron interference correction delivering more precise and faster heading determination. The low-profile LGA package measures 3.0 x 3.0 x 1.0 mm and operates over the -40 to + 85°C temperature range from a supply voltage of 2.16 to 3.6 V. It exhibits low current consumption of only 20 μA at a 7-S/s data rate and a low noise level of only 0.4 mGauss total RMS.
The MC5883MA is complete system incorporating on-chip signal processing and an integrated I2C 400-kHz FAST mode operation digital interface for direct connectivity to the system microprocessor. Devices premounted on prototyping boards can be purchased directly from MEMSIC. Designers can evaluate and log data using MEMSIC’s Universal Evaluation Board.
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Rick NelsonRick Nelson
Contributing Editor
Rick Nelson is a technical journalist who has served as executive editor of Test & Measurement World, chief editor of EDN, and executive editor of EE-Evaluation Engineering. He has also contributed to publications including Vision Systems Design and Electronic Design, and he has participated in many live panel discussions and webcasts. Rick has also held systems-engineering and product-development positions at General Electric and Litton Industries. He received his B.S.E.E. degree from The Pennsylvania State University.
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