Thousands to catch the 5G wave at IMS2017

May 31, 2017

Honolulu, HI. The IEEE MTT-S International Microwave Symposium (IMS) will celebrate its 60th year from June 4-9, 2017, in Honolulu. IMS, the annual flagship conference and exhibition of the IEEE Microwave Theory and Techniques Society (MTT-S), will welcome thousands of attendees involved in emerging RF, microwave, and wireless technologies. IMS will feature over 450 exhibitors from around the world debuting the latest advances in wireless communications, wearable electronics, defense, aerospace, medical applications, and more. The symposium last visited Hawaii in 2007.

“This year’s conference will incorporate new innovations to highlight the exciting developments in the RF and microwave industry, providing an enriching experience for the technical community,” said Monte Watanabe, IMS2017 general vice chair of marketing and publications. “This collaboration and exchange of ideas can make 5G and the Internet of Things a universal reality, translating into growth and opportunities for the industry.”

The innovations presented at the symposium are the foundation for next-generation technologies for industries such as the Internet of Things, machine learning, multigigabit/low-latency data transmission, and virtual/augmented reality. “IMS is the nexus of research and industry in the RF and microwave space, and products available in the exhibit hall enable the realization of these advanced technologies,” said Kevin Miyashiro, IMS2017 general co-chair.

Here are some highlights from the symposium:

  • 5G: IMS2017’s theme of “5G—Catch the Wave!” will bring together thought leaders from industry, academia, and government, representing all aspects of the 5G spectrum. The IEEE 5G Summit at IMS2017 is part of a special collaboration that complements IEEE MTT-S’s “hardware and systems” focus with IEEE Communications Society’s “networking and services” focus. Speakers for the 5G Executive Forum will share their inside view of the emerging 5G market and include industry experts from Intel Labs, GLOBALFOUNDRIES, Escape Communications, Kwikbit, and Keysight Technologies.
  • Practical hands-on training and exhibitor interactions: Education, information, and products that attendees can immediately learn and apply will boost attendee’s productivity. Special features include Fireside Chats in the 5G Pavilion, RF Boot Camp, new Exhibitor Workshops, MicroApps, dedicated exhibit-only time on June 7, and “Pau Hana with the Pros.”
  • Keynote speakers: Experts from NTT DOCOMO, University of California, San Diego, Huawei, and the FCC will weigh in on all aspects of the 5G market, from transceivers and radios to deployment and public policy.

“Focusing on 5G at IMS2017 is a natural fit as Hawaii is home to a significant milestone in wireless technology,” said Wayne Shiroma, IMS2017 general chair. “In 1971, researchers at the University of Hawaii unveiled the pioneering computer networking system called ALOHAnet, becoming the first to connect computers via radio communications and introducing the computing world to random-access protocols. Today, this random access technology is everywhere—in Wi-Fi, mobile phones, Ethernet, and cable—and continues to evolve as a result of the research presented at IMS2017.”

As part of Microwave Week, IMS2017 will also feature the RFIC Symposium and the ARFTG Conference. The conference consists of a full week of events, including technical paper presentations, workshops, and short courses, and the world’s most comprehensive RF and microwave vendor exhibition.

IMS2017 registration is available onsite. For more details, visit the IMS2017 registration page.

See alsoWLAN, radar, IoT, V2X to complement 5G at IMS.”

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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