Milpitas, CA. FlexTech, a SEMI strategic association partner, will host a one-day flexible hybrid electronics and sensors automotive industry workshop in Detroit on September 13, 2017, to explore how flexible hybrid electronics (FHE) adds functionality, decreases weight, and impacts design. Automotive and electronics industry leaders will gather to discuss the market demands and challenges with automotive technology and present disruptive changes brought by FHE and sensors.

The forum will breakdown the topic into four key areas:

• OEM applications,
• market analysis and forecasts,
• challenges to integration, and
• solutions for Tier 2 and Tier 3 suppliers.

Speakers include representatives from SBD Automotive, Fiat-Chrysler Group LLC, Velodyne LiDAR, Lumitex, Alpha Micron, NextFlex, Auburn University, Universal Instruments, Interlink Electronics, Georgia Institute of Technology, and DuPont Photovoltaics & Advanced Materials.

“This forum is an excellent opportunity to discover the possibilities of flexible electronic systems incorporating advance semiconductors, MEMS, and sensors, will provide lightweight, sensor networks that conform, curve, and possibly more. New automotive applications in this area will enable wholly new approaches for the in-cabin driving experience,” said Dr. Melissa Grupen-Shemansky, CTO for Flexible Electronics & Advanced Packaging at SEMI | FlexTech.

Company tours to Ford and a networking dinner are scheduled for September 12, 2017. For more information on the forum and how to register visit the event website at www.semi/org/en/FHE-forum-summary.

See related articles:

• “SEMICON West session looks at electronic requirements for medtech” and
• “SEMICON West targets smart automotive, medtech, manufacturing.”