pSemi releases 8-channel LED boost power supply at APEC

March 7, 2018

San Antonio, TX. pSemi Corp. (formerly Peregrine Semiconductor), a Murata company focused on semiconductor integration, introduced at APEC the PE23300 fully integrated LED boost power supply in package (PSiP) based on a charge-pump, switched-capacitor architecture that offloads most of the power-conversion work from the inductor to capacitors in the charge pump.

Powering up to eight LED strings at a total power level of up to 10 W, the PE23300 is designed specifically to power LED backlight arrays in ultrahigh-definition (UHD) and high-definition (HD) LCD panels for 2-cell and 3-cell narrow-voltage DC notebooks as well as industrial and automotive displays.

“The PE23300 truly demonstrates pSemi’s power-semiconductor capabilities. The PSiP delivers a unique, two-stage architecture that brings ground-breaking conversion efficiency and small solution size and is packaged with Murata’s advanced, 3D-packaging technology and passive components,” says Stephen Allen, director of strategic marketing at pSemi. “All components required for operation are integrated into a 7.7 x 11.7-mm laminate-based LGA package, which is just 1.6 mm in height. To achieve this small size, we used a ‘die-in-substrate’ 3D-packaging technology. The low profile is also a result of our two-stage architecture that allows us to use a tiny chip inductor. All of this can be achieved with an efficiency that is on average about 5 to 7% higher than the competition, halving the losses in the LED boost.”

Power conversion creates a compromise between size and efficiency: The smaller the solution, the worse the efficiency. This compromise impacts OEMs trying to make next-generation, ultracompact products, because they need both a very high conversion efficiency and a very small size at the same time. pSemi solves this problem with a novel, two-stage architecture that offloads most of the power-conversion work from the inductor to a virtually lossless charge pump and relies on small, multilayer ceramic capacitors (MLCCs) to do most of the work. As a result, the inductor—usually the largest and tallest component—can be reduced dramatically in size, and traditional wire-wound inductors can be replaced with chip inductors. This patented architecture was first developed by Arctic Sand Technologies, an MIT spin-out acquired by pSemi in March 2017 and commercialized this year.

Beyond the smaller inductor and higher efficiency, this architecture delivers several other key benefits for LED boosts, including full short-circuit protection and a very flat efficiency over the entire load range. Also, efficiency is virtually independent of the output voltage, and this allows more LEDs per string. With fewer strings, efficiency is optimized, and the display-bezel size can be reduced in width. pSemi’s PE23300 features low power dissipation—up to half that of competing products, the company said—that improves reliability and supports portable applications’ extensive battery run times.

The PE23300 features an input voltage range of 4.5 to 15 VDC and powers up to eight strings of LEDs at up to 45 V and 40 mA per string. The PSiP provides full programmability via an I2C interface with settings stored in nonvolatile memory or by using GPR pins. Dimming resolution is up to 12 bits with an additional 3-bit dithering and can be either linear/logarithmic analog and PWM dimming or direct PWM dimming for maximum flexibility and resolution. The part features an LED brightness ramp up/down control with programmable ramp rate, linear/logarithmic ramp profiles and phase-shifted PWM dimming among active strings to minimize audible noise.

Murata releases 1-W regulated SMT DC/DC converter

In addition, Murata announced it has expanded its product range of embedded-core technology DC/DC converters with the NXF1 fully regulated, high-isolation converter with 3.3-V or 5-V outputs from Murata Power Solutions. Inputs available are nominal 3.3 V and 5 V in an industry-standard surface-mount package with a uniquely low profile. Line regulation is typically better than 0.03%, and load regulation is typically better than 0.5%. All parts have continuous short circuit protection with auto re-start or latch-off depending on model and temperature. Input range is ±5 % around the nominals of 3.3 V and 5 V.

Parts are 100% production tested to 3 kVDC and have agency recognition pending for ‘basic’ protection at 250 VRMS and ‘reinforced’ protection at 125 VRMS to UL60950. Medical recognition to ANSI/AAMI ES 60601-1 is also pending for 2 MOOPs (Means Of Operator Protection) and 1 x MOPP (Means Of Patient Protection) at 125 VRMS and 1 MOOP based upon a working voltage of 250  VRMS max, between Primary and Secondary.

Typical applications for these converters are in systems where agency-recognized isolation is required with tight output regulation as is needed in power for remote pressure, Hall-effect, mass airflow, and other sensors. Markets addressed include alternative energy/solar power, transportation, telecom/wireless equipment, and medical.

“The NXF1 Series is an exciting new product which builds on our unique embedded magnetic core technology giving our customers great electrical and isolation performance with hassle-free placement at a competitive price,” said Ann-Marie Bayliss, product manager, Murata Power Solutions.

The NXF1 Series is rated at -40° to +105° C with derating depending on model and provides high reliability with its patented embedded-core technology which makes production fully automatic yielding a cost-effective product with excellent performance repeatability.

Packaging is the industry-standard footprint for SMT 1-W converters in the Murata proprietary iLGA inspectable format with gold plated terminations. Height is 5.01 mm maximum including tolerances. Parts are fully compatible with Pb-free soldering and are backwards-compatible with Sn/Pb systems and can be mounted in accordance with J-STD-020 with a classification temperature of 260° C and Moisture Sensitivity Level (MSL) 2.

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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