CHANDLER, AZ—Rogers Corporation has introduced TC350 Plus laminates.
TC350 Plus laminates are ceramic-filled PTFE-based woven glass reinforced composite materials providing a cost-effective, high-performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is suited for higher power microwave and industrial heating applications requiring higher maximum operating temperatures, low circuit losses, and thermal dissipation within the circuit board. Additionally, the advanced filler system used enables the composite to have much improved mechanical drilling performance when compared with other competitive laminates. This will result in lower manufacturing costs during circuit board fabrication.
The standard TC350 Plus laminates are offered with a smooth (Rq = 1.0µm) electrodeposited copper foil cladding to reduce insertion loss and RF heating of conductors within the circuit. Resistive foil and metal plate options are available upon request. TC350 Plus laminates are available in thicknesses from 0.010” to 0.060” to address higher power design needs.
The woven glass reinforcement combined with the high filler content of the laminate affords excellent dimensional stability. Other key features of the laminate include low z-axis CTE (38ppm/°C) for plated through-hole reliability, low loss tangent of 0.0017 at 10 GHz to enable low loss designs, low moisture absorption of 0.05% to ensure stable performance in a range of operating environments, high dielectric strength of 650 V/mil to ensure good Z-axis insulation between conductor layers, and UL 94 V-0 flammability performance to enable the use of the material in commercial applications.
TC350 Plus laminates are used in a range of applications including Amplifiers, Combiners, Power Dividers, Couplers, and Filters. Applicable markets range from Commercial and Consumer to Defense and Aerospace.