FRAMOS offers ON Semiconductor’s XGS imagers with HiSPi interface

Oct. 13, 2019

3 min read

FRAMOS has announced that ON Semiconductor has expanded its high-performance XGS family of Global Shutter CMOS image sensors with two new models: the XGS 9400 and the XGS 8000. These devices provide resolutions of 9.4 and 8.8 megapixels, respectively, in a compact package, achieving high-speed performance in a single formfactor. Both models are suited for integration into 29-mm x 29-mm-cameras for machine-vision, ITS, security, medical, and scientific applications.

The XGS family is available with different resolutions in a single package; all the image sensors are pin-compatible. The XGS 9400 is a 1/1.2-in.-type square-format imager with a 13.9 diagonal and 3,072 x 3,072 active pixels. The XGS 8000 has an optical format of 1/1.1" and reaches 4K UHDR resolution with a 14.8 diagonal and 4,096 x 2,160 pixels. Both XGS models have a pixel size of 3.2 µm and are available in monochrome and Bayer color formats from ON Semiconductor’s value-added distributor FRAMOS.

Sibel Yorulmaz-Cokugur, sensor expert at FRAMOS, says, "Power consumption and heat generation are important considerations for embedding vision into industrial vision systems. Both new XGS imagers only require < 1 W at full speed and full resolution. Also, they provide stable performance over wide range of operating temperatures from -40°C to +85°C, which makes them great candidates for environments exposed to weather and sunlight."

The imager’s frame rate in high-speed mode achieves a maximum of 128 frames per second (fps) at 12 bits over 24 lanes in the 8-MP version and 90 fps in the 9.4-MP version. The frame rates of both models can be reduced to 80 fps or 56 fps in low-speed mode by companding the bandwidth and implementing only 12 lanes. The high speed, 12−bit output can maximally leverage interfaces like USB 3.2, Thunderbolt 2, and 10 GigE for industrial environments.

Image data is output through a column ADC architecture and is transferred over a HiSPi interface. The on-chip logic, which is programmable through the serial interface, generates internal timing for both integration and readout control. Up to 8 regions of interest (ROI) can be defined to reduce the data load and conserve lane capacity. Up to three register configurations can be programmed and sequentially enabled (frame-by-frame) with a single command over the control interface.

FRAMOS is available to support customers with the integration of these new sensors into their applications and projects. Evaluation kits contain the sensor, a headboard, frame buffer, and base board. In addition, FRAMOS provides services like development support, customization, and logistics. Currently, the sensor is in production mass release.

www.framos.com