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Integrated Drivers, Advanced Protection Simplify GaN Power-Supply Designs (Download)

May 2, 2025
Log in to download the PDF of this article on using TOLL-packaged GaN devices in a range of power-based applications.

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High efficiency and high power density are critical characteristics when designing power supplies for today’s products. To achieve these goals, developers are turning to gallium nitride (GaN), a wide-bandgap semiconductor technology that achieves high switching frequencies. Compared to competing power semiconductor technologies, GaN minimizes the size of required passive components while simultaneously lowering gate-drive and reverse-recovery losses.

In addition, semiconductor manufacturers are packaging their GaN devices in highly integrated industry-standard footprints that shrink printed-circuit-board (PCB) real-estate requirements while streamlining supply chains.

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