DRAM deal deepens

July 19, 2007
Munich, Germany and Hsinchu, Taiwan: German memory maker Qimonda AG and Taiwanese fab firm Winbond Electronics agreed to expand their joint effort regarding DRAM production. Under terms of the agreement, Qimonda will transfer its 75nm and 58nm

Munich, Germany and Hsinchu, Taiwan: German memory maker Qimonda AG and Taiwanese fab firm Winbond Electronics agreed to expand their joint effort regarding DRAM production. Under terms of the agreement, Qimonda will transfer its 75nm and 58nm DRAM trench technology to Winbond’s 300mm facility in Taichung, Taiwan. In return, Winbond will manufacture DRAMs for computing applications in these technologies exclusively for Qimonda.

The transfer of Qimonda’s 58nm technology will also enable Winbond to develop and sell respective proprietary speciality memories. Qimonda will receive license fees and royalties.

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